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问:*金鹏电子制程能力

答:

JINPENG Manufacturing Capacity 2021

金鹏电子制程能力2021

Comprehensive monthly capacity : 250,000㎡

综合月产能:25万㎡

LAYER: ≤12

层数:≤12层

Product type: FR-4 (high Tg, high CTI, halogen-free, impedance plate, BGA plate, thick copper plate (6oz), buried blind hole plate, PTH half hole plate), CEM-1, CEM-3, aluminum substrate, mini & micro LED

产品类型:FR-4(高TG、高CTI、无卤素、阻抗板、BGA板、厚铜板(6oz)、埋盲孔板、PTH半孔板)、CEM-1、CEM-3、铝基板、mini & micro LED类

Board Material

原材料

Base Material:KB/ SYTECH

Aluminum substrate: CSEM / WAZAM

常规板材:建滔/生益

铝基板:清晰/华正

Printing ink:TAIYO/Eternal/ABQ/Sekisui

油墨:太阳、长兴、板桥、积水

Surface Finishing

表面处理

HASL,HASL Leadfree,ENIG(ImmersionGold),OSP(Entek),
Immersion Tin,Immercial Silver,Hard Gold

铅锡,纯锡,化金,OSP,化锡,化银,镀硬金

Selective Surface Finishing

选择性表面处理

ENIG(Immersion Gold)+OSP,ENIG+Gold Finger,Immersion Silver+Glod Finger,Immersion Tin+Gold Finger

化金+OSP,化金+金手指,化银+金手指,化锡+金手指

Technical Specification

技术参数

Min Line Width:4/4mil

最小线宽:4/4mil

Min Hole Size:0.25mm(Mechanical Drill)

最小孔径:0.25mm(机械钻孔)

Min Annular Ring:5mil

最小焊环:5mil

Max Copper Thickness:60Z(Outer Layer)

最厚铜厚:60Z(外层)

Max Panel Size:540mm*650mm

最大成品尺寸:540mm*650mm

Board Thickness:0.4nn-3.0mm

板厚:0.4mm-3.0mm

Min Solder Mask Bridge≧0.08mm

阻焊桥:≧0.08mm

Aspect ratio:7:1

板厚孔径比(纵横比):7:1

Pluggine Vias Capabioity:0.2-0.6mm

塞孔能力:0.2-0.6mm

Impedance Control:10%

阻抗控能:±10%

Tolerance

公差

Plated Holes Tolerance:±0.08mm(min±0.05)

金属化孔:±0.08mm(极限±0.05)

Non-Plated Hole Tolerance:  ±0.05mm(min+0/-0.075mm or+0.075/-0mm)

非金属化孔:±0.05mm(极限+0/-0.075mm or+0.075/-0mm)

Outline Tolerance:±0.15mm(min±0.10mm)

外形公差:±0.15mm(极限±0.10mm)

Functional Test

功能测试

Insulating Resisitance:50ohms(normality)

绝缘电阻:50ohms(常态)

Peel Off Strength:1.4N/mm

可剥离强度:1.4N/mm

Thermal Stress Test:260 degree,20seconds

热冲击测试:260℃,20秒

Soder Mask Hardness:≧6H

阻焊剂硬度:≧6H


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